Title :
Architectural benefits and design challenges for three-dimensional integrated circuits
Author :
Xie, Jing ; Zhao, Jishen ; Dong, Xiangyu ; Xie, Yuan
Author_Institution :
Comput. Sci. & Eng. Dept., Pennsylvania State Univ., University Park, PA, USA
Abstract :
The emerging three-dimensional integrated circuit (3D IC) is one of the promising solutions for future IC design. This tutorial gives an overview of various approaches for future 3D IC design, with the benefits of fast latency, higher bandwidth, and heterogeneous integration capability that are offered by the 3D technology. The design challenges for future 3D ICs are also discussed.
Keywords :
integrated circuit design; three-dimensional integrated circuits; 3D IC design; 3D technology; architectural benefits; design challenges; integration capability; three-dimensional integrated circuits; Computer architecture; Irrigation; Testing; Three dimensional displays;
Conference_Titel :
Circuits and Systems (APCCAS), 2010 IEEE Asia Pacific Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4244-7454-7
DOI :
10.1109/APCCAS.2010.5775083
