• DocumentCode
    3233470
  • Title

    Efficient 2D approximation for Layout-dependent Relaxation of Etch Stop Liner Stress due to Contact Holes

  • Author

    Liebmann, Rainer ; Nawaz, Muhammad ; Bach, Karl Heinz

  • Author_Institution
    TCAD Simulation, Infineon Technol. AG, Munich
  • fYear
    2006
  • fDate
    6-8 Sept. 2006
  • Firstpage
    173
  • Lastpage
    175
  • Abstract
    Stress engineering to enhance device performance has become widespread. One way is to apply an etch stop liner with intrinsic stress, which causes stress and thus changed mobility in the channel of the device. Etching contact holes reduces this stress. Investigating the dependence of the channel stress on the position of the contact holes is a genuine 3D problem. Here we describe a method to determine the width-averaged channel stress by a much more efficient 2D simulation
  • Keywords
    etching; hole mobility; stress effects; 2D approximation; contact hole; device channel mobility; etch stop liner stress; layout-dependent relaxation; stress engineering; Content addressable storage; Electronic mail; Etching; Geometry; Knowledge engineering; Periodic structures; Shape; Silicon; Solid modeling; Stress; contact holes; layout dependence; liner stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2006 International Conference on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    1-4244-0404-5
  • Type

    conf

  • DOI
    10.1109/SISPAD.2006.282866
  • Filename
    4061609