DocumentCode
3233470
Title
Efficient 2D approximation for Layout-dependent Relaxation of Etch Stop Liner Stress due to Contact Holes
Author
Liebmann, Rainer ; Nawaz, Muhammad ; Bach, Karl Heinz
Author_Institution
TCAD Simulation, Infineon Technol. AG, Munich
fYear
2006
fDate
6-8 Sept. 2006
Firstpage
173
Lastpage
175
Abstract
Stress engineering to enhance device performance has become widespread. One way is to apply an etch stop liner with intrinsic stress, which causes stress and thus changed mobility in the channel of the device. Etching contact holes reduces this stress. Investigating the dependence of the channel stress on the position of the contact holes is a genuine 3D problem. Here we describe a method to determine the width-averaged channel stress by a much more efficient 2D simulation
Keywords
etching; hole mobility; stress effects; 2D approximation; contact hole; device channel mobility; etch stop liner stress; layout-dependent relaxation; stress engineering; Content addressable storage; Electronic mail; Etching; Geometry; Knowledge engineering; Periodic structures; Shape; Silicon; Solid modeling; Stress; contact holes; layout dependence; liner stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2006 International Conference on
Conference_Location
Monterey, CA
Print_ISBN
1-4244-0404-5
Type
conf
DOI
10.1109/SISPAD.2006.282866
Filename
4061609
Link To Document