DocumentCode
3233530
Title
Minienvironments and thermal effects
Author
Schliesser, Jochen ; Staudt-Fischbach, Peter
Author_Institution
Fraunhofer Soc., Stuttgart, Germany
fYear
1999
fDate
1999
Firstpage
432
Lastpage
439
Abstract
Current trends in cleanroom technology are moving away from conventional systems and towards localized areas so-called minienvironments. To date, production facilities have been set up as ballrooms, clean-benches or minienvironments with a simple encapsulation, either in connection with a cleanroom ceiling or with their own air purification systems. The air filter technology available on the market today easily fulfills current requirements for eliminating particles. The encapsulation often consists of simple wall units with access for maintenance. However, optimal airflows and cleanliness around the substrate cannot be achieved using this method. All cleanliness relevant functional units must be considered as a whole “minienvironment system”. Functional units are the surrounding cleanroom technology, the supply and removal of process media, process equipment, production and operational organization, e.g. substrate handling and the personnel employed. The minienvironment system should center on optimizing airflows around the substrate, thus fulfilling the highest cleanliness requirements possible. The aim of minienvironment technology is to provide a “substrate cleanroom” only in the immediate surroundings where the substrate requires the highest cleanliness conditions. One of the most important influences on the first airflow are thermal effects caused by, for example, hotplates. The thermals created by the hotplate directly affect the direction of the airflow in the minienvironment, and the stagnant zone above the hotplate increases. This paper considers minienvironments using a minimal cleanliness volume around the process chamber. The paper will provide information obtained from several experiments and their results. From the obstruction of airflows resulting from such items as hotplates, it has been possible to develop a method for designing minienvironment systems required to handle thermal problems
Keywords
clean rooms; air filter; air flow; air purification system; cleanliness; contamination control; encapsulation; hotplate; minienvironment; process chamber; semiconductor production facility; substrate cleanroom technology; thermal effects; Displacement control; Encapsulation; Manufacturing automation; Optimized production technology; Production facilities; Semiconductor device manufacture; Substrates; Temperature control; Thermal expansion; Velocity control;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
0-7803-5217-3
Type
conf
DOI
10.1109/ASMC.1999.798309
Filename
798309
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