• DocumentCode
    3233611
  • Title

    High-frequency surface acoustic wave (SAW) devices fabricated by contact-transferred and mask-embedded lithography

  • Author

    Liu, Chin-Hsin ; Chiu, Cheng-Yu ; Lee, Yung-Chun ; Chang, Shuo Hung

  • Author_Institution
    Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    402
  • Lastpage
    405
  • Abstract
    This paper reports the application of a newly developed lithography method, the contact transfer and mask-embedded lithography (CMEL), in fabricating high-frequency (~2 GHz) surface acoustic wave (SAW) filters. In sort, CMEL utilizes a thin metal film deposited on an anti-adhesion layer and a silicon mold with pre-fabricated features. The metal film bearing the mold´s surface pattern can be transferred into a photo-resist layer deposited on a substrate. Subsequent etchings complete the lithography and the micro/nano-fabrication. To demonstrate CMEL and its potential, we apply CMEL for fabricating inter-digital transducers of SAW filters with a line width down to 500 nm. Using a LiNbO3 substrate, the operating frequency can reach 1.8 to 2 GHz based on this simple and easy-to-implement lithography method. Details in the CMEL, the lithography results, the high-frequency performance of the fabricated SAW devices, as well as future developments of this simple lithography method will be addressed.
  • Keywords
    etching; interdigital transducers; lithium compounds; photoresists; surface acoustic wave filters; thin films; LiNbO3; SAW filter; antiadhesion layer; contact-transferred lithography; etchings; fabricated SAW device; high-frequency surface acoustic wave; interdigital transducer; mask-embedded lithography; microfabrication; nanofabrication; photoresist layer; thin metal film deposition; Acoustic waves; Etching; Filters; Lithography; Semiconductor films; Silicon; Substrates; Surface acoustic wave devices; Surface acoustic waves; Transducers; SAW; contact transfer; mask; nano-impriningt;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484359
  • Filename
    4484359