Title :
High-frequency surface acoustic wave (SAW) devices fabricated by contact-transferred and mask-embedded lithography
Author :
Liu, Chin-Hsin ; Chiu, Cheng-Yu ; Lee, Yung-Chun ; Chang, Shuo Hung
Author_Institution :
Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan
Abstract :
This paper reports the application of a newly developed lithography method, the contact transfer and mask-embedded lithography (CMEL), in fabricating high-frequency (~2 GHz) surface acoustic wave (SAW) filters. In sort, CMEL utilizes a thin metal film deposited on an anti-adhesion layer and a silicon mold with pre-fabricated features. The metal film bearing the mold´s surface pattern can be transferred into a photo-resist layer deposited on a substrate. Subsequent etchings complete the lithography and the micro/nano-fabrication. To demonstrate CMEL and its potential, we apply CMEL for fabricating inter-digital transducers of SAW filters with a line width down to 500 nm. Using a LiNbO3 substrate, the operating frequency can reach 1.8 to 2 GHz based on this simple and easy-to-implement lithography method. Details in the CMEL, the lithography results, the high-frequency performance of the fabricated SAW devices, as well as future developments of this simple lithography method will be addressed.
Keywords :
etching; interdigital transducers; lithium compounds; photoresists; surface acoustic wave filters; thin films; LiNbO3; SAW filter; antiadhesion layer; contact-transferred lithography; etchings; fabricated SAW device; high-frequency surface acoustic wave; interdigital transducer; mask-embedded lithography; microfabrication; nanofabrication; photoresist layer; thin metal film deposition; Acoustic waves; Etching; Filters; Lithography; Semiconductor films; Silicon; Substrates; Surface acoustic wave devices; Surface acoustic waves; Transducers; SAW; contact transfer; mask; nano-impriningt;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location :
Sanya
Print_ISBN :
978-1-4244-1907-4
Electronic_ISBN :
978-1-4244-1908-1
DOI :
10.1109/NEMS.2008.4484359