• DocumentCode
    3233699
  • Title

    Theoretical modeling and experimental verification on imprinting mechanism of laser assisted direct imprinting (LADI)

  • Author

    Lee, Yung-Chun ; Ruan, Jun-Yi ; Hsiao, Fei-Bin ; Chen, Chun-Ming

  • Author_Institution
    Inst. of Nanotechnol. & Microsyst. Eng., Nat. Cheng Kung Univ., Tainan
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    418
  • Lastpage
    421
  • Abstract
    This paper discusses the theoretical modeling of laser assisted direct imprinting (LADI) which utilizes a quartz mold, pulsed laser heating, and contact pressure for direct fabricating nanostructures on a silicon substrate. Based on pulsed laser heating, liquid film squeezing, and elastodynamic theories, a unified theory has successfully developed which not only quantitatively explains the fundamental mechanism of LADI but also can be used to predict correlations between the final imprinting depth and several important parameters including laser fluence, contact pressure, and feature size. To verify this theory, a series of LADI experiments have been carried out. Experimental results, in their general trends, are in agreement with the theoretical predictions and therefore supporting the validity of the modeling. Physical implications and potential applications of this modeling will be addressed.
  • Keywords
    nanolithography; soft lithography; contact pressure; elastodynamic theories; imprinting mechanism; laser assisted direct imprinting; liquid film squeezing; pulsed laser heating; quartz mold; Elastodynamics; Heating; Laser modes; Laser theory; Nanostructured materials; Nanostructures; Nanotechnology; Optical pulses; Silicon; Substrates; laser assisted direct imprinting; theoretical modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484363
  • Filename
    4484363