DocumentCode :
3233855
Title :
On a microfabricated Ti-alloy-based microneedle array for transdermal drug delivery
Author :
Hou, Wensheng ; Das, B. ; Jiang, Yingtao ; Qian, Shizhi ; Zheng, Xiaolin ; Yang, Jun ; Pi, Xitian ; Liu, Hongying ; Zheng, Jun ; Zhang, Yi
Author_Institution :
Dept. of Biomed. Eng., Chongqing Univ., Chongqing
fYear :
2008
fDate :
6-9 Jan. 2008
Firstpage :
453
Lastpage :
456
Abstract :
Transdermal drug delivery is a promising approach that allows controlled release of drug over time while avoiding possible degradation due to the gastrointestinal tract or first-pass liver effect. Of many different methods have been employed in transdermal drug delivery, microneedle is a widely explored MEMS-based device that can conveniently penetrate the skin and thus create micrometer-scale openings for drug absorption. In this paper, we attempt to study a Ti alloy-based microneedle array, particularly its fluidic features, through a series of simulations using ANSYS. The results indicate that, provided the volumetric flow rate is constant, the pressure of inlet decreases when the flow rate of inlet increases; the flow rate of outlet increases with the increase of pressure of inlet when flow rate of inlet is set to constant. In both scenarios, a complete description of liquid flow through microneedle conduit should consider in vivo effects such as the liquid absorption in the epidermis and the mechanic feature.
Keywords :
drug delivery systems; micromechanical devices; titanium alloys; ANSYS simulations; MEMS-based device; Ti; first-pass liver effect; gastrointestinal tract; in vivo effects; liquid absorption; micrometer-scale openings; microneedle array microfabrication; transdermal drug delivery; volumetric flow rate; Absorption; Degradation; Drug delivery; Epidermis; Fluid flow; Gastrointestinal tract; In vivo; Liver; Skin; Titanium alloys; Drug delivery; fluidic feature; microneedle; transdermal;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location :
Sanya
Print_ISBN :
978-1-4244-1907-4
Electronic_ISBN :
978-1-4244-1908-1
Type :
conf
DOI :
10.1109/NEMS.2008.4484370
Filename :
4484370
Link To Document :
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