DocumentCode
3234256
Title
2D ring array transducers for real-time 3D imaging of atrial septal defect repair
Author
Light, Edward D. ; Lindsey, Brooks D. ; Upchurch, Joseph A. ; Smith, Stephen W.
Author_Institution
Dept. of Biomed. Eng., Duke Univ., Durham, NC, USA
fYear
2011
fDate
18-21 Oct. 2011
Firstpage
230
Lastpage
233
Abstract
We developed new miniature 2D array ring transducers integrated into interventional device catheters such as deploy atrial septal occluders. One transducer consisted of 55 elements operating near 5 MHz. The interelement spacing is 0.20 mm. It was constructed on a flat piece of copper-clad polyimide and then wrapped around an 11 French catheter. We used a braided wiring technology from Tyco Electronics Corp to connect the elements to our real-time 3D ultrasound scanner. Typical measured transducer element bandwidth was 20% centered at 4.7 MHz. We built another 55 element transducer with a single matching layer. The matching layer is from EBL Products, Inc. and is the #107 matching layer, .19 mm thick. The matching layer plate was metallized on both sides with 500 Å of nickel and 1000 Å of gold prior to bonding to the PZT layer with Epotek 301 Epoxy. The resulting average bandwidth was 60% centered at 4.4 MHz.
Keywords
catheters; gold; lead compounds; maintenance engineering; metallisation; nickel; optical scanners; real-time systems; resins; ultrasonic imaging; ultrasonic transducer arrays; EBL products; Epotek 301 epoxy; French catheter; Ni-PZT-Au; PZT layer; Tyco Electronics Corp; atrial septal defect repair; atrial septal occluders; braided wiring technology; copper-clad polyimide; frequency 4.4 MHz; frequency 4.7 MHz; interelement spacing; interventional device catheters; matching layer; miniature 2D array ring transducers; real-time 3D imaging; real-time 3D ultrasound scanner; transducer element bandwidth measurement; Arrays; Catheters; Imaging; Real time systems; Transducers; Ultrasonic imaging; Wiring; 2D array transducer; real-time 3D imaging; septal occluder;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2011 IEEE International
Conference_Location
Orlando, FL
ISSN
1948-5719
Print_ISBN
978-1-4577-1253-1
Type
conf
DOI
10.1109/ULTSYM.2011.0056
Filename
6293629
Link To Document