DocumentCode :
3234256
Title :
2D ring array transducers for real-time 3D imaging of atrial septal defect repair
Author :
Light, Edward D. ; Lindsey, Brooks D. ; Upchurch, Joseph A. ; Smith, Stephen W.
Author_Institution :
Dept. of Biomed. Eng., Duke Univ., Durham, NC, USA
fYear :
2011
fDate :
18-21 Oct. 2011
Firstpage :
230
Lastpage :
233
Abstract :
We developed new miniature 2D array ring transducers integrated into interventional device catheters such as deploy atrial septal occluders. One transducer consisted of 55 elements operating near 5 MHz. The interelement spacing is 0.20 mm. It was constructed on a flat piece of copper-clad polyimide and then wrapped around an 11 French catheter. We used a braided wiring technology from Tyco Electronics Corp to connect the elements to our real-time 3D ultrasound scanner. Typical measured transducer element bandwidth was 20% centered at 4.7 MHz. We built another 55 element transducer with a single matching layer. The matching layer is from EBL Products, Inc. and is the #107 matching layer, .19 mm thick. The matching layer plate was metallized on both sides with 500 Å of nickel and 1000 Å of gold prior to bonding to the PZT layer with Epotek 301 Epoxy. The resulting average bandwidth was 60% centered at 4.4 MHz.
Keywords :
catheters; gold; lead compounds; maintenance engineering; metallisation; nickel; optical scanners; real-time systems; resins; ultrasonic imaging; ultrasonic transducer arrays; EBL products; Epotek 301 epoxy; French catheter; Ni-PZT-Au; PZT layer; Tyco Electronics Corp; atrial septal defect repair; atrial septal occluders; braided wiring technology; copper-clad polyimide; frequency 4.4 MHz; frequency 4.7 MHz; interelement spacing; interventional device catheters; matching layer; miniature 2D array ring transducers; real-time 3D imaging; real-time 3D ultrasound scanner; transducer element bandwidth measurement; Arrays; Catheters; Imaging; Real time systems; Transducers; Ultrasonic imaging; Wiring; 2D array transducer; real-time 3D imaging; septal occluder;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2011 IEEE International
Conference_Location :
Orlando, FL
ISSN :
1948-5719
Print_ISBN :
978-1-4577-1253-1
Type :
conf
DOI :
10.1109/ULTSYM.2011.0056
Filename :
6293629
Link To Document :
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