A 3-D Time-Dependent Green´s Function Approach to Modeling Electromagnetic Noise in On-Chip Interconnect Networks

We present a methodology for investigating the response of a complex on-chip interconnect network to external and internal noise, through the development of a 3-D solver based on creating a lumped element model of an interconnect network and solving for its impulse responses. Our method exhibits a lower computational cost than SPICE and allows the user the flexibility to work on a wide variety of interconnect network geometries as well as to include as many parasitic effects as desired for the application