DocumentCode :
3234421
Title :
Multiple Type Grid Approach for 3D Process Simulation
Author :
Kimpton, D. ; Baida, M. ; Zhuk, V. ; Temkin, M. ; Chakarov, I.
Author_Institution :
Silvaco Int., Santa Clara, CA
fYear :
2006
fDate :
6-8 Sept. 2006
Firstpage :
369
Lastpage :
372
Abstract :
Various aspects of discretization and data representation in a generic 3D process simulator are discussed. It is shown that the only practical way to provide the efficient and robust simulation of various process steps is to use application specific gridding and numeric methods for distinct process step and provide smooth synchronization and data transformation between the simulation modules. We demonstrate how this approach can be successfully used for simulation of complete 50 nm MOSFET device cell starting from the physical layout and finish with simulation of its IV characteristics using the device simulator ATLAS3D
Keywords :
MOSFET circuits; semiconductor process modelling; MOSFET device cell; device simulator ATLAS3D; generic 3D process simulator; multiple type grid approach; Computational modeling; Data models; Etching; Geometry; Interpolation; MOSFET circuits; Robustness; Simulated annealing; Skeleton; Topology; ATLAS3D; Etching; annealing; deposition; device; implantation; process; simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2006 International Conference on
Conference_Location :
Monterey, CA
Print_ISBN :
1-4244-0404-5
Type :
conf
DOI :
10.1109/SISPAD.2006.282911
Filename :
4061654
Link To Document :
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