Title :
Design and implementation of a LTCC-based receiver front-end module
Author :
Zhong-Yun, Li ; Geng-Hua, Zeng ; Peng, Chen ; Jian-Yu, Yang
Author_Institution :
Inst. of Electron. Eng., China Acad. of Eng. Phys., Mianyang, China
Abstract :
A S-band receiver front-end module using Low Temperature Co-fired Ceramic technology is presented to be small and reliable with the main passive components such as splitter, coupler, bandpass filter, resistors and capacitors embedded in LTCC substrates. The MCM-level module with a dimension of 27mm×25mm×1.9mm, realized in interconnecting the active chips by micro-assembly technology, is shown to meet the requirements quite well in experimental test.
Keywords :
ceramic packaging; microassembling; receivers; LTCC substrates; LTCC-based receiver front-end module; MCM-level module; S-band receiver front-end module; bandpass filter; low temperature co-fired ceramic technology; micro-assembly technology; splitter; Assembly systems; Band pass filters; Capacitors; Design engineering; Microwave circuits; Nonhomogeneous media; Radar antennas; Reliability engineering; Resistors; Signal design;
Conference_Titel :
Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-5705-2
DOI :
10.1109/ICMMT.2010.5525100
