• DocumentCode
    3234851
  • Title

    EEI´s wafer-cell bipolar battery: versatile technology for a variety of military systems

  • Author

    Brown, Jack T. ; Klein, Martin G. ; Reisner, David E.

  • Author_Institution
    Electro Energy Inc., Danbury, CT, USA
  • fYear
    1996
  • fDate
    9-12 Jan 1996
  • Firstpage
    51
  • Lastpage
    55
  • Abstract
    A new versatile battery cell design based on stackable wafer cells is described which forms the unit building block of a new generation of bipolar battery systems for a wide variety of military applications. Current is transported across an outer envelope of conductive plastic film. This innovative bipolar design approach offers improved energy density based on more efficient packaging in prismatic containers as well as elimination of cell hardware. Higher power capability is achieved from the intrinsic low resistance operation in a bipolar mode. These performance improvements are achieved in a low-cost package by virtue of the design simplicity and use of nongraphitic plastic-bonded electrodes. EEI has demonstrated the viability of the wafer cell approach in Ni-MH with sealed cell cycle life in excess of 2000 cycles. Results are also reported for Ag-MH
  • Keywords
    electrochemical electrodes; electrochemistry; life testing; military equipment; power supplies to apparatus; secondary cells; Ag-H2; Ag-MH; Ni-H2; Ni-MH; conductive plastic film; design approach; electrochemical performance; energy density; intrinsic low resistance operation; military applications; packaging; power capability; prismatic containers; rechargeable batteries; sealed cell cycle life; wafer-cell bipolar battery; Batteries; Conductive films; Contacts; Costs; Electrodes; Packaging; Particle separators; Polymer films; Seals; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Battery Conference on Applications and Advances, 1996., Eleventh Annual
  • Conference_Location
    Long Beach, CA
  • Print_ISBN
    0-7803-2994-5
  • Type

    conf

  • DOI
    10.1109/BCAA.1996.484969
  • Filename
    484969