DocumentCode :
3234996
Title :
Microfluidic chip fabrication for silicon mold insert by micro hot embossing
Author :
Yung-Hsun Shin ; Shen, Yung-Kang ; Lin, Yi ; Lee, Jeou-Long ; Lin, Chon-Ta ; Lee, Chien-Pang ; Wu, Ming-Wei
Author_Institution :
Sch. of Dentistry, Taipei Med. Univ., Taipei
fYear :
2008
fDate :
6-9 Jan. 2008
Firstpage :
690
Lastpage :
693
Abstract :
This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.
Keywords :
Taguchi methods; embossing; lithography; microfluidics; micromachining; moulding; silicon; surface roughness; Taguchi method; lithography technology; micro hot embossing; microfluidic chip fabrication; silicon mold insert; surface roughness; Bonding; Chip scale packaging; Embossing; Lithography; Microfluidics; Optical polymers; Rough surfaces; Silicon; Surface roughness; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location :
Sanya
Print_ISBN :
978-1-4244-1907-4
Electronic_ISBN :
978-1-4244-1908-1
Type :
conf
DOI :
10.1109/NEMS.2008.4484423
Filename :
4484423
Link To Document :
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