Title :
Simulation of multi-chip module package resonance using commercial finite element electromagnetic software
Author :
Clark, Robin ; Agrawal, Ankit ; Miller, Steven
Author_Institution :
Martin Marietta Gov. Electron. Syst., USA
Abstract :
Techniques have been developed to predict package resonance frequencies in multiple cavity, MMIC based, T/R modules, using the HP High Frequency Structure Simulator package. This method accounts for partially filled waveguide modes, perturbations due to GaAs MMICs and their metal spacers, and the effects of imperfect cavity end walls. Calculated results are compared to measured package resonances and module performance data.<>
Keywords :
MMIC; electronic engineering computing; finite element analysis; multichip modules; resonance; simulation; GaAs; HP High Frequency Structure Simulator package; MCM package resonance; MMIC based T/R modules; finite element electromagnetic software; imperfect cavity end walls; metal spacers; multichip module; multiple cavity modules; package resonance frequencies; partially filled waveguide modes; perturbations; Dielectrics; Finite element methods; Geometry; MMICs; Narrowband; Packaging; Propagation constant; Resonance; Resonant frequency; Springs;
Conference_Titel :
Microwave Symposium Digest, 1995., IEEE MTT-S International
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-2581-8
DOI :
10.1109/MWSYM.1995.406189
