DocumentCode
3235101
Title
Simulation of multi-chip module package resonance using commercial finite element electromagnetic software
Author
Clark, Robin ; Agrawal, Ankit ; Miller, Steven
Author_Institution
Martin Marietta Gov. Electron. Syst., USA
fYear
1995
fDate
16-20 May 1995
Firstpage
1211
Abstract
Techniques have been developed to predict package resonance frequencies in multiple cavity, MMIC based, T/R modules, using the HP High Frequency Structure Simulator package. This method accounts for partially filled waveguide modes, perturbations due to GaAs MMICs and their metal spacers, and the effects of imperfect cavity end walls. Calculated results are compared to measured package resonances and module performance data.<>
Keywords
MMIC; electronic engineering computing; finite element analysis; multichip modules; resonance; simulation; GaAs; HP High Frequency Structure Simulator package; MCM package resonance; MMIC based T/R modules; finite element electromagnetic software; imperfect cavity end walls; metal spacers; multichip module; multiple cavity modules; package resonance frequencies; partially filled waveguide modes; perturbations; Dielectrics; Finite element methods; Geometry; MMICs; Narrowband; Packaging; Propagation constant; Resonance; Resonant frequency; Springs;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1995., IEEE MTT-S International
Conference_Location
Orlando, FL, USA
ISSN
0149-645X
Print_ISBN
0-7803-2581-8
Type
conf
DOI
10.1109/MWSYM.1995.406189
Filename
406189
Link To Document