DocumentCode
3235367
Title
High level modeling and validation methodologies for embedded systems: bridging the productivity gap
Author
Shukla, Sandeep K. ; Edwards, Stephen A. ; Talpin, Jean Pierre ; Gupta, Rajesh K.
Author_Institution
Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
fYear
2003
fDate
4-8 Jan. 2003
Firstpage
9
Lastpage
14
Abstract
In this tutorial, we cover the most recent developments in system level design languages and models of computation which influence the choices of modeling paradigms and languages, interoperability of design components created with different modeling styles and languages, synchronous vs. asynchronous system design, and corresponding methodologies based on de-synchronization which leads to new embedded hardware/software co-design methods, formal validation of system level design of embedded hardware/software systems, and component composition frameworks that allows reuse of intellectual properties, and provides efficient simulation and validation environments.
Keywords
asynchronous circuits; circuit simulation; embedded systems; formal verification; hardware description languages; hardware-software codesign; high level languages; industrial property; integrated circuit modelling; logic simulation; object-oriented programming; open systems; simulation languages; C++; IP reuse; VHDL; asynchronous system design; component composition frameworks; computation models; computer aided design tools; de-synchronization; design productivity gap; embedded hardware/software co-design methods; embedded systems; formal validation; high level modeling; intellectual property reuse; interoperability; modeling languages; modeling paradigms; simulation environments; synchronous system design; system level design languages; validation methodologies; Computational modeling; Computer networks; Design engineering; Embedded computing; Embedded system; Handheld computers; Hardware design languages; Pervasive computing; Productivity; System-level design;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, 2003. Proceedings. 16th International Conference on
ISSN
1063-9667
Print_ISBN
0-7695-1868-0
Type
conf
DOI
10.1109/ICVD.2003.1183104
Filename
1183104
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