• DocumentCode
    3235381
  • Title

    Property evaluation of nanofilled polymers

  • Author

    Irwin, P.C. ; Cao, Y. ; Bansal, A. ; Schadler, L.S.

  • Author_Institution
    GE Global Res. Center, Niskayuna, NY
  • fYear
    2004
  • fDate
    23-26 May 2004
  • Firstpage
    21
  • Lastpage
    26
  • Abstract
    Interest has grown in recent years on the effects of nanosized fillers on the properties of polymeric systems. In particular, we arc interested in studying the changes in electrical, mechanical, and thermal properties of thermosetting polyimides as coated and uncoated nanosized fillers are added in increasing levels of concentration. The results are compared to micronsized filled polyimides of similar compositions. The electrical conduction of the nanocomposites is found to be thermally assisted ionic in nature. The data shows deeper trapping by the nanofillers. We have also observed interesting changes in % elongation and thermal conductivity while modulus levels do not change significantly. A change in stress state during failure is proposed for the: observed improved mechanical properties. Thermal conductivity of the filled polymer systems seemed to be most affected by a coating on the surface of the nanofillers. Interfacial adhesion and percolation theory is suggested as a possible explanation for the differences
  • Keywords
    adhesion; electrical conductivity; filled polymers; insulating coatings; modules; nanocomposites; percolation; thermal conductivity; coated nanosized fillers; deeper trapping; electrical conduction; electrical property; interfacial adhesion; mechanical property; micronsized filled polyimides; modulus levels; nanocomposites; nanofilled polymers; percolation theory; polymeric system property; surface coating; thermal conductivity; thermal property; thermosetting polyimides; uncoated nanosized fillers; Current measurement; Dielectric measurements; Dielectrics and electrical insulation; Electrodes; Mechanical factors; Performance evaluation; Polymers; Testing; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Modulator Symposium, 2004 and 2004 High-Voltage Workshop. Conference Record of the Twenty-Sixth International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-8586-1
  • Type

    conf

  • DOI
    10.1109/MODSYM.2004.1433497
  • Filename
    1433497