DocumentCode :
3235566
Title :
Development of multi-layer for Au nanorod assembly
Author :
Leem, Myoung-Kun ; Kim, Chang-Man ; Kim, Kyu-Jin ; Kang, Won-Seok ; Kim, Jae-Ho ; Lee, Jung-Hee ; Kwon, Dae-Hyuk ; Kang, Shin-Won
Author_Institution :
Dept. of Electron. Eng., Kyungpook Nat. Univ., Daegu
fYear :
2008
fDate :
6-9 Jan. 2008
Firstpage :
838
Lastpage :
841
Abstract :
In this study, dielectrophoresis (DEP) principle was used to assemble Au nanorods which were synthesized by electrochemical deposition (ECD) method. The nanorod assembly electrode was designed by considering the simulation and fabricated using semiconductor fabrications. In experiment, only 1st layer and multilayer were experienced to compare the Au nanorod assembly efficiency. First, assembly efficiency was about 20 % when 20 kHz, 20 Vp-p (AC) was applied on the only 1st layer. Second, multi-layer was designed for getting high assembly efficiency. Assembly efficiency was improved by 45 % when 10 V (DC) was applied on the 1st layer electrode and 20 kHz, 20 Vp-p (AC) was applied on the 2nd layer electrode. As a result, the Au nanorod assembly efficiency of the multi-layer was increased about 25 % than assembly efficiency of the only 1st layer.
Keywords :
electrodeposition; electrophoresis; nanostructured materials; Au nanorod assembly; dielectrophoresis principle; electrochemical deposition method; multilayer development; nanorod assembly electrode; semiconductor fabrication; Assembly systems; Dielectric constant; Dielectrophoresis; Electrodes; Fabrication; Frequency; Gold; IEEE members; Nanobioscience; Voltage; ECD; dielectrophoresis (DEP); nanorod assembly;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location :
Sanya
Print_ISBN :
978-1-4244-1907-4
Electronic_ISBN :
978-1-4244-1908-1
Type :
conf
DOI :
10.1109/NEMS.2008.4484454
Filename :
4484454
Link To Document :
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