Author_Institution :
Assembly Test Div., Teradyne, North Reading, MA
Abstract :
This paper describes the techniques and technologies used to create a high performance, high density, multi-functional analog test instrument. Overcoming density challenges, while maintaining optimal performance levels, requires the careful selection of parts in order to balance functionality, power dissipation, and board area. This paper discusses technologies such as a custom analog ASIC, semi-custom cooling, programmable digital logic, and PCB materials, and how these elements combine to result in a highly functional analog test design in a minimized footprint.
Keywords :
analogue integrated circuits; automatic test equipment; printed circuit design; printed circuit testing; PCB materials; analog test design; analog test instrument; custom analog ASIC; design approaches; high density; high performance; programmable digital logic; semi custom cooling; Application specific integrated circuits; Circuit testing; Connectors; Cooling; Instruments; Logic testing; Packaging; Power dissipation; Space technology; Thermal resistance; Analog Test Instrument; Density; Design; Performance;