DocumentCode
3235764
Title
Roller imprinting based on focus infrared heating
Author
Chun-Hung Chen ; Yung-Chun Lee ; Chii-Dong Chen ; Shuei-Jin Lai ; Shih-Jay iaw
Author_Institution
Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan
fYear
2008
fDate
6-9 Jan. 2008
Firstpage
877
Lastpage
880
Abstract
In this paper we report the development of a new roller imprinting method which is capable of transferring patterns with line-width down to few hundreds nm from a silicon mold to a substrate based on focused infrared heating. This new technique significantly increases the size of imprinting area as well as the imprinting speed as compared to conventional IR- Laser Assisted Imprinting (IR-LAI) method, and solves the uniformity problem of applied pressure. We utilize a glass cylinder to focus the infrared light source into a line, which can heat up the silicon mold in a localized way. The glass cylinder also produces a line-type pre-loaded force on the mold so that it can closely press against the substrate. After the heating by IR sources, the fast rising temperature in the silicon mold and the PMMA on the silicon substrate can go beyond the glass transition temperature of PMMA. At the same time, the patterns which are on the mold are transferred to the PMMA. After cooling, the residual PMMA layer is etched out which complete this IR imprinting process. The advantages of this method are, using inexpensive IR sources such as lamps, continuously imprinting for large-area with line-width down to sub-micro and even nm- scale. In the mean time, this method opens up many new directions and possibilities for further studies.
Keywords
heating; laser materials processing; PMMA; focus infrared heating; glass cylinder; pattern transfer; roller imprinting; silicon mold; silicon substrate; Engine cylinders; Etching; Glass; Heat transfer; Infrared heating; Light sources; Lithography; Resists; Silicon; Temperature; Infrared Heating; PMMA; Roller Imprinting;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location
Sanya
Print_ISBN
978-1-4244-1907-4
Type
conf
DOI
10.1109/NEMS.2008.4484463
Filename
4484463
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