Title :
Ultra high density nondestructive readout M-R memory cells
Author :
Pohm, A.V. ; Comstock, C.S. ; Daughton, J.M. ; Krahn, D.R.
Author_Institution :
Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA
Abstract :
An analytical study of the limiting memory array density that can be achieved by using 65% Ni, 15% Fe, 20% Co multilayer magnetoresistive memory elements is reported. The electromigration limit, demagnetizing fields, temperature rise, thermal stability, and signal-to-noise ratio are the fundamental factors involved. Assuming 0.2-μm minimum feature, lithography and deposited nonconducting keepers, the maximum array density achievable with these materials is 4×108 b/cm2. At this density, access time is reduced to about 15 μs because of the diminished signal level
Keywords :
magnetic storage; magnetoresistance; MR memory elements; Ni-Fe-Co alloy; NiFeCo; access time; demagnetizing fields; deposited nonconducting keepers; electromigration limit; lithography; memory array density; multilayer magnetoresistive memory elements; nondestructive readout M-R memory cells; signal-to-noise ratio; temperature rise; thermal stability; ultra high density; Demagnetization; Electromigration; Iron; Magnetic analysis; Magnetic multilayers; Magnetoresistance; Signal to noise ratio; Temperature; Thermal factors; Thermal stability;
Conference_Titel :
CompEuro '89., 'VLSI and Computer Peripherals. VLSI and Microelectronic Applications in Intelligent Peripherals and their Interconnection Networks', Proceedings.
Conference_Location :
Hamburg
Print_ISBN :
0-8186-1940-6
DOI :
10.1109/CMPEUR.1989.93336