• DocumentCode
    3236485
  • Title

    Higher-order FETD method combined with domain decomposition algorithm analysis of substrate integrated waveguide structures

  • Author

    Li, M. ; Du, L. ; Chen, R.S.

  • Author_Institution
    Dept. of Commun. Eng., Nanjing Univ. of Sci. & Technol., Nanjing, China
  • fYear
    2010
  • fDate
    8-11 May 2010
  • Firstpage
    621
  • Lastpage
    624
  • Abstract
    Based on high order hierarchical vector function, the finite-element time-domain (FETD) method combined with tearing and interconnecting (TI) algorithm is presented. This method is efficient for time domain analysis of substrate integrated waveguide (SIW) structures, since the SIW structures have a lot of fine via holes. By means of the high order hierarchical vector function, the accuracy and ability of FETD simulation of complicated SIW problems are improved. With the aid of non overlapping domain decomposition tearing and interconnecting algorithm, the ill-conditioned spare linear system obtained by the high order hierarchical vector finite element can be solved with direct methods even if the SIW structures lead to very large linear systems. Simulation results have verified this hybrid algorithm.
  • Keywords
    finite element analysis; linear systems; time-domain analysis; waveguides; domain decomposition algorithm; finite-element time-domain method; high order hierarchical vector function; higher-order FETD method; ill-conditioned spare linear system; substrate integrated waveguide structures; tearing and interconnecting algorithm; time domain analysis; Algorithm design and analysis; Circuits; Electromagnetic waveguides; Finite element methods; Large-scale systems; Linear systems; Maxwell equations; Partial differential equations; Time domain analysis; Vectors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-5705-2
  • Type

    conf

  • DOI
    10.1109/ICMMT.2010.5525185
  • Filename
    5525185