DocumentCode
3236520
Title
A methodology for accurate modeling of energy dissipation in array structures
Author
Mamidipaka, Mahesh N. ; Dutt, Nikil D. ; Khouri, Kamal S.
Author_Institution
Center for Embedded Comput. Syst., California Univ., Irvine, CA, USA
fYear
2003
fDate
4-8 Jan. 2003
Firstpage
320
Lastpage
325
Abstract
There is an increasing need for obtaining a reasonably accurate estimate of energy dissipation in SoC designs. Array structures have a significant contribution to the total system level energy consumption. In this paper, we propose a new methodology to develop analytical models for accurately estimating energy dissipation in array structures. The methodology is based on the characterization of arrays for energy as a function of micro-architecture level inputs. The coefficients of the function are extracted using circuit level simulations. We apply the proposed methodology to develop energy models for three different array structures used in the Motorola e500 processor core. The models are validated by comparing them against post-layout SPICE simulation. The energy models are seen to be highly accurate with an error margin of less than 8%. While the experiments are specific to the e500 processor core based array structures, the methodology is generic and can be used to develop energy models for array structures of any SOC design.
Keywords
SPICE; circuit simulation; integrated circuit design; low-power electronics; microprocessor chips; system-on-chip; Motorola e500; SoC designs; array structures; circuit level simulations; energy dissipation; energy models; error margin; micro-architecture level inputs; post-layout SPICE simulation; processor core; total system level energy consumption; Analytical models; Application software; Circuit simulation; Costs; Embedded computing; Energy consumption; Energy dissipation; Logic arrays; Power dissipation; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, 2003. Proceedings. 16th International Conference on
ISSN
1063-9667
Print_ISBN
0-7695-1868-0
Type
conf
DOI
10.1109/ICVD.2003.1183157
Filename
1183157
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