DocumentCode :
3236530
Title :
Avalanche injection in high voltage Si P-i-N diodes measurements and device simulations
Author :
Domeij, Martin ; Breitholtz, Bo ; Linnros, Jan ; Östling, Mikael
Author_Institution :
Dept. of Electron., R. Inst. of Technol., Stockholm, Sweden
fYear :
1997
fDate :
26-29 May 1997
Firstpage :
125
Lastpage :
128
Abstract :
Measurements have been performed with a new experimental technique using optical excitation for studying avalanche injection during reverse recovery in a power diode. Effects on the diode Safe Operating Area (SOA) caused by the junction termination design can be neglected in the experiments because the optical excitation of carriers is restricted only to the central region of the diode. Measurements can be done in different diode areas, making it possible to do several SOA measurements on one diode. 1D device simulations fail to predict the turn-off failure which is observed in measurements. In the performed experiments, turn-off failure occurs at a power density varying between 500 kW/cm2 at 800 V and 300 kW/cm2 at 1200 V, and occurs after peak power which for some measurements is as high as 700 kW/cm2. A comparison between these measurements and published results for the onset of avalanche injection in bipolar power transistors and Gate Turn-Off thyristors (GTOs) indicate a wider SOA for the power diode
Keywords :
avalanche breakdown; failure analysis; p-i-n diodes; power semiconductor diodes; semiconductor device models; semiconductor device reliability; 1D device simulations; 300 to 1250 V; GTOs; Si; avalanche injection; bipolar power transistors; diode safe operating area; high voltage Si P-i-N diodes; junction termination design; optical excitation; power density; reverse recovery; turn-off failure; Area measurement; Density measurement; Optical design; P-i-n diodes; Performance evaluation; Power measurement; Power transistors; Predictive models; Semiconductor optical amplifiers; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and IC's, 1997. ISPSD '97., 1997 IEEE International Symposium on
Conference_Location :
Weimar
ISSN :
1063-6854
Print_ISBN :
0-7803-3993-2
Type :
conf
DOI :
10.1109/ISPSD.1997.601451
Filename :
601451
Link To Document :
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