• DocumentCode
    3236530
  • Title

    Avalanche injection in high voltage Si P-i-N diodes measurements and device simulations

  • Author

    Domeij, Martin ; Breitholtz, Bo ; Linnros, Jan ; Östling, Mikael

  • Author_Institution
    Dept. of Electron., R. Inst. of Technol., Stockholm, Sweden
  • fYear
    1997
  • fDate
    26-29 May 1997
  • Firstpage
    125
  • Lastpage
    128
  • Abstract
    Measurements have been performed with a new experimental technique using optical excitation for studying avalanche injection during reverse recovery in a power diode. Effects on the diode Safe Operating Area (SOA) caused by the junction termination design can be neglected in the experiments because the optical excitation of carriers is restricted only to the central region of the diode. Measurements can be done in different diode areas, making it possible to do several SOA measurements on one diode. 1D device simulations fail to predict the turn-off failure which is observed in measurements. In the performed experiments, turn-off failure occurs at a power density varying between 500 kW/cm2 at 800 V and 300 kW/cm2 at 1200 V, and occurs after peak power which for some measurements is as high as 700 kW/cm2. A comparison between these measurements and published results for the onset of avalanche injection in bipolar power transistors and Gate Turn-Off thyristors (GTOs) indicate a wider SOA for the power diode
  • Keywords
    avalanche breakdown; failure analysis; p-i-n diodes; power semiconductor diodes; semiconductor device models; semiconductor device reliability; 1D device simulations; 300 to 1250 V; GTOs; Si; avalanche injection; bipolar power transistors; diode safe operating area; high voltage Si P-i-N diodes; junction termination design; optical excitation; power density; reverse recovery; turn-off failure; Area measurement; Density measurement; Optical design; P-i-n diodes; Performance evaluation; Power measurement; Power transistors; Predictive models; Semiconductor optical amplifiers; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and IC's, 1997. ISPSD '97., 1997 IEEE International Symposium on
  • Conference_Location
    Weimar
  • ISSN
    1063-6854
  • Print_ISBN
    0-7803-3993-2
  • Type

    conf

  • DOI
    10.1109/ISPSD.1997.601451
  • Filename
    601451