Title :
Novel bounce drive actuator for large step displacement and low friction micromotor applications
Author :
Huang, I-Yu ; Chen, Guan-Ming ; Lee, Yen-Chi ; Horng, Alex
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung
Abstract :
This investigation presents an innovative bounce drive actuator (BDA) to develop a rotary micromotor with low friction and large step displacement. The BDA device has a shorter plate and wider bushing designs than the conventional scratch drive actuator (SDA), resulting in a new electrostatic bounceback driving mechanism and a larger step size of motion. The innovative bounce actuating mechanism considerably reduces the friction between the free end of the BDA-plate and the nitride insulator and effectively eliminates the sudden reverse rotation effect of SDA. Additionally, this study introduces three advanced designs (filleted supporting beam, flanged cover and ribbed/dimpled inside-ring) into the structure of a BDA-based rotary micromotor to decrease further the abrasion between the inside-ring of the rotor and the cover, anchor and inside-rail; reduce the driving voltage and increase the lifetime. The BDA- based micromotors developed in this work (with 398 mum in diameter) were fabricated using the MEMSCAPreg Poly-MUMPs process and many improvements, including the large step displacement (180-196 nm), low driving voltage (70 -95 Vo-p), long lifetime (> 72 hrs) and consistent rotary direction were demonstrated.
Keywords :
electrostatic actuators; flanges; micromotors; rotors; MEMSCAP Poly-MUMPs process; bounce actuating mechanism; bounce drive actuator; electrostatic bounceback driving mechanism; large step displacement; low friction micromotor; nitride insulator; reverse rotation effect; rotary micromotor; Capacitive sensors; Dielectric substrates; Drives; Electrostatic actuators; Friction; Insulators; Micromotors; Pneumatic actuators; Systems engineering and theory; Voltage; Bounce drive actuator (BDA); Filleted supporting-beam; Flanged cover; Micromotor; Ribbed/dimpled inside-ring;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location :
Sanya
Print_ISBN :
978-1-4244-1907-4
Electronic_ISBN :
978-1-4244-1908-1
DOI :
10.1109/NEMS.2008.4484524