DocumentCode :
3237167
Title :
A scalable SOI technology for three successive generations: 0.18, 0.13 and 0.1 μm for low-voltage and low-power applications
Author :
Pelloie, J.L. ; Faynot, O. ; Raynaud, C. ; Dunne, B. ; Martin, F. ; Tedesco, S. ; Hartmann, J.
Author_Institution :
LETI, CEA-Technol. Avancees, Grenoble, France
fYear :
1996
fDate :
30 Sep-3 Oct 1996
Firstpage :
118
Lastpage :
119
Abstract :
Optimized 0.18 μm gate length NMOSFET and PMOSFET SOI devices have been demonstrated with high electrical performances for low-voltage and low-power applications. The electrical results show that this SOI design can be easily scaled down for the next generations and no heavy ion implant (In or Sb) is required
Keywords :
MOSFET; silicon-on-insulator; 0.1 micron; 0.13 micron; 0.18 micron; NMOSFET; PMOSFET; electrical performance; low-power applications; low-voltage applications; scalable SOI technology; Aging; Annealing; Current measurement; Hot carriers; Length measurement; Low voltage; MOS devices; MOSFET circuits; Threshold voltage; Transconductance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1996. Proceedings., 1996 IEEE International
Conference_Location :
Sanibel Island, FL
ISSN :
1078-621X
Print_ISBN :
0-7803-3315-2
Type :
conf
DOI :
10.1109/SOI.1996.552522
Filename :
552522
Link To Document :
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