DocumentCode :
3237275
Title :
Characterization and modeling of emitter-base leakage in high speed SiGe NPNs
Author :
Dahlström, M. ; Camillo-Castillo, R.A.
Author_Institution :
Microelectron. Div., IBM, Essex Junction, VT
fYear :
2008
fDate :
13-15 Oct. 2008
Firstpage :
137
Lastpage :
140
Abstract :
Leakage through the base is a common yield detractor in SiGe NPNs. The defects are commonly referred to as dasiapipespsila and are manifested as a current path between emitter and collector independent of base bias. In this article we discuss pipes which have been observed due to retarded base growth. Advanced light/thermally induced voltage alterations (LIVA) and cross section transmission electron microscopy (XTEM) were used to identify these defects, which resulted in leakage paths through the base to the collector. The pipes were found to have resistances ranging 100-200 kOmega, and could be modeled as junction field-effect transistors (JFETs) in which the pipes serve as the channel and the base as the gate electrode. Technology computer-aided design (TCAD) was utilized to model the pipes and provide insight into their behavior. In particular, the higher CE leakage currents of NPNs containing a selective collector implant are explained by changes in the conduction band resulting from the SIC implant. This correlates with observed NPN yield trends.
Keywords :
BiCMOS integrated circuits; Ge-Si alloys; crystal defects; heterojunction bipolar transistors; junction gate field effect transistors; leakage currents; semiconductor growth; transmission electron microscopy; SIC implant; SiGe; advanced light-thermally induced voltage alterations; common yield detractor; conduction band; cross section transmission electron microscopy; emitter-base leakage; gate electrode; high-speed NPNs; junction field-effect transistors; pipes; resistance 100 kohm to 200 kohm; retarded-base growth; selective collector implant; technology computer-aided design; Design automation; Electrodes; FETs; Germanium silicon alloys; Implants; JFETs; Leakage current; Silicon germanium; Transmission electron microscopy; Voltage; Bipolar/BiCMOS; HBT; NPN; SiGe; TCAD; bipolar; emitter; leakage; pipes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting, 2008. BCTM 2008. IEEE
Conference_Location :
Monteray, CA
ISSN :
1088-9299
Print_ISBN :
978-1-4244-2725-3
Electronic_ISBN :
1088-9299
Type :
conf
DOI :
10.1109/BIPOL.2008.4662731
Filename :
4662731
Link To Document :
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