• DocumentCode
    3237352
  • Title

    Surface passivation techniques for GaAs power Schottky diodes

  • Author

    Wright, N.G. ; Johnson, C.M. ; Neill, A. G O

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
  • fYear
    1997
  • fDate
    26-29 May 1997
  • Firstpage
    141
  • Lastpage
    144
  • Abstract
    In recent years, there has been a growing interest in the use of GaAs as a material for high voltage power Schottky diodes. Such devices have been shown to have much lower reverse recovery charge than Si junction diodes and thus to have many potential applications in high-speed switching circuits. However, most Schottky diodes suffer from reverse leakage currents significantly greater than predicted by simple consideration of the Schottky Barrier Height (SBH)-largely as a result of surface leakage. Such problems can be controlled in silicon devices, for which surface passivation methods utilising field oxide and/or electron irradiation are available. By comparison, surface passivation techniques for GaAs devices are relatively undeveloped, although attempts have been made using sulphur and/or selenium coating solutions for low power devices. In this work, we have applied such techniques to power Schottky diodes with the aim of engineering the metal/semiconductor interface to control the forward and reverse characteristics of the device
  • Keywords
    III-V semiconductors; Schottky diodes; gallium arsenide; leakage currents; passivation; semiconductor-metal boundaries; GaAs; forward characteristics; high-speed switching circuits; metal/semiconductor interface; power Schottky diodes; reverse leakage currents; reverse recovery charge; surface leakage; surface passivation techniques; Electrons; Gallium arsenide; Leakage current; Passivation; Schottky barriers; Schottky diodes; Semiconductor diodes; Silicon devices; Switching circuits; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and IC's, 1997. ISPSD '97., 1997 IEEE International Symposium on
  • Conference_Location
    Weimar
  • ISSN
    1063-6854
  • Print_ISBN
    0-7803-3993-2
  • Type

    conf

  • DOI
    10.1109/ISPSD.1997.601455
  • Filename
    601455