DocumentCode
3238231
Title
Analysis of electromagnetic scattering using UV method enhanced marching-on-in-order time-domain integral equations
Author
Wang, Q.Q. ; Shi, Y.F. ; Li, M.M. ; Fan, Z.H. ; Chen, R.S.
Author_Institution
Dept. of Commun. Eng., Nanjing Univ. of Sci. & Technol., Nanjing, China
fYear
2010
fDate
8-11 May 2010
Firstpage
117
Lastpage
120
Abstract
In this paper, the UV method is utilized to reduce both the memory requirement and computational complexity in time-domain combined field integral equation (TD-CFIE) method to analyze scattering from arbitrarily shaped conducting structures. The UV method takes advantage of the rank-deficiency feature and it is kernel-independent. Different orders of weighted Laguerre polynomials are used as temporal basis functions and the unknown expansion coefficients of the time variable are solved recursively order by order, as the so-called matching-on-in-order procedure. RWG basis function is used as the spatial basis function for its flexibility in modeling arbitrary geometries. The spatial and temporal testing procedures are separate, and both of them are carried on with the Galerkin´s method. Numerical results are given to verify the proposed method.
Keywords
electromagnetic wave scattering; integral equations; polynomials; Galerkin method; Laguerre polynomials; RWG basis function; UV method; arbitrarily shaped conducting structures; computational complexity; electromagnetic scattering; marching-on-in-order time-domain integral equations; memory requirement; rank-deficiency feature; spatial basis function; spatial testing; temporal basis functions; temporal testing; time-domain combined field integral equation; unknown expansion coefficients; Computational complexity; Electromagnetic analysis; Electromagnetic scattering; Geometry; Integral equations; Moment methods; Polynomials; Solid modeling; Testing; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-5705-2
Type
conf
DOI
10.1109/ICMMT.2010.5525272
Filename
5525272
Link To Document