DocumentCode :
3238530
Title :
Measurement of electron and hole impact ionization coefficients for SiC
Author :
Raghunathan, R. ; Baliga, B.J.
Author_Institution :
Power Semiconductor Res. Center, North Carolina State Univ., Raleigh, NC, USA
fYear :
1997
fDate :
26-29 May 1997
Firstpage :
173
Lastpage :
176
Abstract :
Silicon carbide has received increasing attention for power switching, microwave and high temperature applications due to its high breakdown electric field, thermal conductivity and electron saturation drift velocity. One of the most important parameters of a SiC power device is its breakdown voltage. In order to obtain a clear understanding of its breakdown characteristics, it is important to have an exact knowledge of the impact ionization coefficients for SiC. However, there is very little information available in literature for 6H-SiC and none for 4H-SiC. In this work, measured impact ionization coefficient data for 4H and 6H-SiC are provided as a function of temperature. It is demonstrated that that the data obtained from these measurements allows a more accurate simulation of reverse breakdown voltage characteristics than that obtained using previously published data. These results have widespread utility for SiC device analysis and design
Keywords :
electric breakdown; impact ionisation; power semiconductor switches; semiconductor materials; silicon compounds; thermal conductivity; SiC; breakdown voltage; device analysis; electron impact ionization coefficients; electron saturation drift velocity; hole impact ionization coefficients; power switching; reverse breakdown voltage characteristics; thermal conductivity; Charge carrier processes; Electric breakdown; Electric variables measurement; Electron beams; Impact ionization; Pulse measurements; Schottky diodes; Silicon carbide; Temperature; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and IC's, 1997. ISPSD '97., 1997 IEEE International Symposium on
Conference_Location :
Weimar
ISSN :
1063-6854
Print_ISBN :
0-7803-3993-2
Type :
conf
DOI :
10.1109/ISPSD.1997.601463
Filename :
601463
Link To Document :
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