DocumentCode
3238562
Title
Temperature Control of High-Performance Multi-core Platforms Using Convex Optimization
Author
Murali, Srinivasan ; Mutapcic, Almir ; Atienza, David ; Gupta, Rajesh ; Boyd, Stephen ; Benini, Luca ; De Micheli, Giovanni
Author_Institution
LSI, EPFL, Lausanne
fYear
2008
fDate
10-14 March 2008
Firstpage
110
Lastpage
115
Abstract
With technology advances, the number of cores integrated on a chip and their speed of operation is increasing. This, in turn is leading to a significant increase in chip temperature. Temperature gradients and hot-spots not only affect the performance of the system, but also lead to unreliable circuit operation and affect the life-time of the chip. Meeting the temperature constraints and reducing the hot-spots are critical for achieving reliable and efficient operation of complex multi-core systems. In this work, we present Pro-Temp, a convex optimization based method that pro-actively controls the temperature of the cores, while minimizing the power consumption and satisfying application performance constraints. The method guarantees that the temperature of the cores are below a user- defined threshold at all instances of operation, while also reducing the hot-spots. We perform experiments on several realistic multi-core benchmarks, which show that the proposed method guarantees that the cores never exceed the maximum temperature limit, while matching the application performance requirements. We compare this to traditional methods, where we find several temperature violations during the operation of the system.
Keywords
convex programming; integrated circuit design; integrated circuit reliability; microprocessor chips; temperature control; thermal management (packaging); Pro-Temp method; chip temperature; convex optimization; high-performance multicore platforms; hot-spots reduction; power consumption reduction; reliable circuit operation; temperature control; temperature gradients; thermal-aware processor design; Circuits; Energy consumption; Energy management; Frequency; Large scale integration; Permission; Power system management; Power system reliability; Temperature control; Thermal management; Thermal-aware design; dynamic frequency scaling; static and dynamic optimization; temperature control;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe, 2008. DATE '08
Conference_Location
Munich
Print_ISBN
978-3-9810801-3-1
Electronic_ISBN
978-3-9810801-4-8
Type
conf
DOI
10.1109/DATE.2008.4484671
Filename
4484671
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