Title :
Fatigue and Creep in Solder Joints
Author :
Homa, Thomas R. ; Huebner, R.T.
Author_Institution :
IBM Corporation, Endicott, NY
Keywords :
Capacitive sensors; Capacitors; Creep; Fatigue; Lead; Packaging; Soldering; Substrates; Surface-mount technology; Temperature;
Conference_Titel :
Southern Tier Technical Conference, 1987. Proceedings of the 1987 IEEE
DOI :
10.1109/STIER.1987.716389
