DocumentCode
3239046
Title
Temperature-Aware Scheduling and Assignment for Hard Real-Time Applications on MPSoCs
Author
Chantem, Thidapat ; Dick, Robert P. ; Hu, X. Sharon
Author_Institution
Dept. of CSE, Univ. of Notre Dame, Notre Dame, IN
fYear
2008
fDate
10-14 March 2008
Firstpage
288
Lastpage
293
Abstract
Thermal effects in MPSoCs may cause the violation of timing constraints in real-time systems. This paper presents a mixed integer linear programming based solution to this problem. Tasks are assigned and scheduled to an MPSoC to minimize peak temperature, subject to real-time constraints. The proposed approach outperforms existing methods, reducing peak temperature by up to 24.66degC and by an average of 8.75degC when compared to minimal-energy solutions. We also present a heuristic for use on large problem instances. Steady- state thermal analysis is used for tasks with long execution times compared to the RC thermal time constants of the cores. Transient analysis is used otherwise. The steady-state analysis based heuristic finds solutions with at most 3.40degC deviation from optimal peak temperature (0.22degC on average) while improving upon existing technique by as much as 25.71degC and 10.86degC on average. The transient analysis based heuristic further reduce peak temperature by 1degC in the best case and 0.17degC on average.
Keywords
integer programming; integrated circuit packaging; linear programming; system-on-chip; thermal analysis; thermal management (packaging); MPSoC; minimal-energy solutions; mixed integer linear programming; real-time applications; steady-state thermal analysis; temperature 24.66 C; temperature-aware scheduling; thermal effects; transient analysis; Cooling; Costs; Packaging; Real time systems; Runtime; Steady-state; Temperature; Thermal conductivity; Timing; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe, 2008. DATE '08
Conference_Location
Munich
Print_ISBN
978-3-9810801-3-1
Electronic_ISBN
978-3-9810801-4-8
Type
conf
DOI
10.1109/DATE.2008.4484694
Filename
4484694
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