• DocumentCode
    3239046
  • Title

    Temperature-Aware Scheduling and Assignment for Hard Real-Time Applications on MPSoCs

  • Author

    Chantem, Thidapat ; Dick, Robert P. ; Hu, X. Sharon

  • Author_Institution
    Dept. of CSE, Univ. of Notre Dame, Notre Dame, IN
  • fYear
    2008
  • fDate
    10-14 March 2008
  • Firstpage
    288
  • Lastpage
    293
  • Abstract
    Thermal effects in MPSoCs may cause the violation of timing constraints in real-time systems. This paper presents a mixed integer linear programming based solution to this problem. Tasks are assigned and scheduled to an MPSoC to minimize peak temperature, subject to real-time constraints. The proposed approach outperforms existing methods, reducing peak temperature by up to 24.66degC and by an average of 8.75degC when compared to minimal-energy solutions. We also present a heuristic for use on large problem instances. Steady- state thermal analysis is used for tasks with long execution times compared to the RC thermal time constants of the cores. Transient analysis is used otherwise. The steady-state analysis based heuristic finds solutions with at most 3.40degC deviation from optimal peak temperature (0.22degC on average) while improving upon existing technique by as much as 25.71degC and 10.86degC on average. The transient analysis based heuristic further reduce peak temperature by 1degC in the best case and 0.17degC on average.
  • Keywords
    integer programming; integrated circuit packaging; linear programming; system-on-chip; thermal analysis; thermal management (packaging); MPSoC; minimal-energy solutions; mixed integer linear programming; real-time applications; steady-state thermal analysis; temperature 24.66 C; temperature-aware scheduling; thermal effects; transient analysis; Cooling; Costs; Packaging; Real time systems; Runtime; Steady-state; Temperature; Thermal conductivity; Timing; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe, 2008. DATE '08
  • Conference_Location
    Munich
  • Print_ISBN
    978-3-9810801-3-1
  • Electronic_ISBN
    978-3-9810801-4-8
  • Type

    conf

  • DOI
    10.1109/DATE.2008.4484694
  • Filename
    4484694