DocumentCode :
3239580
Title :
Packaging guidelines for PC cards
Author :
Marsh, Ed
Author_Institution :
Commun. Products Div., AMP Inc., Winston-Salem, NC, USA
fYear :
1995
fDate :
10-12 Oct 1995
Firstpage :
312
Lastpage :
314
Abstract :
PC cards which comply with the PCMCIA Association´s specification PC Card Standard are available in three basic styles. PC card frame kit packaging provides a rugged user friendly enclosure for applications requiring resistance to mechanical bending, drops, and vibration. The user choice of styles is dependent on their cost budget, manufacturing volumes, and appearance criteria. Most frame kit suppliers have assembly tooling available to assist the user in their manufacturing process. As pricing pressures mount for card manufacturers, frame kit suppliers continue to develop more cost effective designs to meet these needs. This packaging technique has also spread to applications other than PCMCIA cards to capitalise on its assets for consumer electronic PCB packaging
Keywords :
add-on boards; digital storage; packaging; PC Card Standard; PC card frame kit packaging; PC cards; PCMCIA Association´s specification; drop resistance; mechanical bending resistance; user friendly enclosure; vibration resistance; Application software; Assembly; Bonding; Guidelines; Insulation; Manufacturing processes; Packaging; Plastics; Steel; Thickness control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Northcon 95. I EEE Technical Applications Conference and Workshops Northcon95
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-2639-3
Type :
conf
DOI :
10.1109/NORTHC.1995.485088
Filename :
485088
Link To Document :
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