Title :
PC Card product design and packaging considerations
Author_Institution :
Northstar Syst. Inc., Rancho Cucamonga, CA, USA
Abstract :
As more and more new PC Card frame kits and I/O connector products become available, product developers will have a variety of choices when designing a PC Card product. The product can be a PC Card fax/modem, fax with a cellular phone connection, LAN, SGSI, fax/LAN combo or fax/modem/sound combo. While it is good to have design choices, it may take up a great deal of developers´ time in sorting out what technologies are good for a particular design. In this paper, the latest packaging technologies and products are examined and the PC Card product design considerations are discussed to provide product developers with some time-saving findings. The discussions are divided into two main sections: the exploration of new PC Card packaging technologies, and PC Card design and packaging considerations
Keywords :
add-on boards; computer interfaces; data communication equipment; packaging; peripheral interfaces; product development; I/O connector products; LAN; PC Card fax/modem; PC Card frame kits; PC Card product design; SGSI; cellular phone connection; fax/LAN combination; fax/modem/sound combination; packaging; Assembly; Connectors; Grounding; Modems; Packaging; Pins; Plastics; Product design; Testing; Welding;
Conference_Titel :
Northcon 95. I EEE Technical Applications Conference and Workshops Northcon95
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-2639-3
DOI :
10.1109/NORTHC.1995.485089
