• DocumentCode
    3240378
  • Title

    LALM: a logic-aware layout methodology to enhance the noise immunity of domino circuits

  • Author

    Im, Yonghee ; Roy, Kaushik

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2003
  • fDate
    20-21 Feb. 2003
  • Firstpage
    45
  • Lastpage
    52
  • Abstract
    The circuit performance is increasingly affected by signal integrity as cross-talk becomes more significant with scaling down of feature sizes. Many attempts have been made to improve noise immunity, but all require the sacrifice of speed as a tradeoff. In some circuits, P/G network is used as shielding wires to avoid cross-talk while maintaining the desired speed, but the use of the network is inherently restricted by electromigration, IR drop, Ldi/dt noise, etc. We propose a novel methodology at to enhance the noise immunity of domino circuits by reordering transistors as well as interconnects based on the functionality of the circuit. To the best of our knowledge, it is the first attempt to use the functionality of a circuit for the purpose of noise immunity enhancement. The methodology, named "Logic-Aware Layout Methodology" (LALM), uses several techniques that can be used to improve the signal integrity of domino circuits. Experimental results show that LALM is simple to apply yet useful in improving the noise immunity of domino circuits.
  • Keywords
    crosstalk; integrated circuit noise; integrated logic circuits; logic design; LALM; circuit functionality; crosstalk; domino circuit; logic-aware layout methodology; net ordering; noise immunity; signal integrity; transistor ordering; Circuit noise; Circuit optimization; Coupling circuits; Crosstalk; Intelligent networks; Logic design; MOSFETs; Semiconductor device noise; Subthreshold current; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI, 2003. Proceedings. IEEE Computer Society Annual Symposium on
  • Print_ISBN
    0-7695-1904-0
  • Type

    conf

  • DOI
    10.1109/ISVLSI.2003.1183352
  • Filename
    1183352