• DocumentCode
    3240731
  • Title

    Keeping cool in the data center: A high - efficiency modular solution

  • Author

    Scofield, Bill ; Hayden, Peter

  • Author_Institution
    Bell Labs., Alcatel-Lucent, Naperville, IL, USA
  • fYear
    2010
  • fDate
    6-10 June 2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Faster, more powerful and dense computing hardware generates significant heat and imposes considerable data center cooling requirements. Traditional computer room air conditioning (CRAC) cooling methods are proving increasingly cost-ineffective and inefficient. Studies show that using the volume of room air as a heat exchange medium is wasteful and allows for substantial mixing of hot and cold air. Further, it limits cabinet/frame/rack density because it cannot effectively cool high heat density equipment that is spaced closely together. A more cost-effective, efficient solution for maximizing heat transfer and enabling higher heat density equipment frames can be accomplished by utilizing properly positioned “phase change” or “two-phase” pumped refrigerant cooling methods. Pumping low-pressure oil-free phase changing refrigerant through micro-channel heat exchangers can provide up to 90% less energy consumption for the primary cooling loop within the room. Additionally, if designed properly, a refrigerant-based system can be deployed to cool existing computing equipment, in existing IT cabinets, without extensive and expensive changes to the present data-center infrastructure. The primary benefits of such a solution include reduced energy requirements, optimized utilization of data center space, and lower OPEX and CAPEX.
  • Keywords
    Air conditioning; Cooling; Energy consumption; Hardware; Heat pumps; Heat transfer; Power generation; Refrigerants; Space heating; Waste heat;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Telecommunications Energy Conference (INTELEC), 32nd International
  • Conference_Location
    Orlando, FL, USA
  • Print_ISBN
    978-1-4244-3383-4
  • Electronic_ISBN
    978-1-4244-3384-1
  • Type

    conf

  • DOI
    10.1109/INTLEC.2010.5525707
  • Filename
    5525707