DocumentCode
3241059
Title
Electrical two and three dimensional modelling of high-speed board to board interconnections
Author
Gailus, Mark ; Fusi, Mary Ann ; Zanella, Fabrizio
fYear
1995
fDate
7-9 Nov. 1995
Firstpage
100
Abstract
In today´s high speed electronic systems, board-to-board connectors can contribute to signal degradation, reflections, and crosstalk. Methods exist for using computer modeling to predict the electrical behavior of interconnections from a knowledge of their materials and construction. A typical modeling process utilizes a combination of 2 or 3 dimensional electromagnetic field solvers to derive an approximate circuit model of the connector. Predictions of connector electrical performance are then obtained by plugging this connector model into a model test circuit and simulating the combination with circuit simulation software such as SPICE. As an example a six-row 2 mm-grid backplane connector is discussed in this paper
Keywords
Circuit simulation; Circuit testing; Connectors; Crosstalk; Degradation; Electromagnetic modeling; Electromagnetic reflection; High-speed electronics; Integrated circuit interconnections; Predictive models;
fLanguage
English
Publisher
ieee
Conference_Titel
WESCON/'95. Conference record. 'Microelectronics Communications Technology Producing Quality Products Mobile and Portable Power Emerging Technologies'
Conference_Location
San Francisco, CA, USA
ISSN
1095-791X
Print_ISBN
0-7803-2636-9
Type
conf
DOI
10.1109/WESCON.1995.485259
Filename
485259
Link To Document