Title :
Packaging of image sensor devices for camera module applications - Keynote Speaker
Author :
Darveaux, Robert
Author_Institution :
Amkor Technology, Inc.,
Abstract :
Provides an abstract of the keynote presentation and a brief professional biography of the presenter. The complete presentation was not made available for publication as part of the conference proceedings.
Keywords :
Assembly; Biological materials; Cameras; Fatigue; Image sensors; Life testing; Mobile handsets; Packaging; Process control; Production;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-7803-8357-5
DOI :
10.1109/ITHERM.2004.1318241
