Title :
Best papers from ITherm 2002
Keywords :
Electronic packaging thermal management; Engineering management; Materials science and technology; Mechanical engineering; Production engineering; Soldering; Technology management; Thermal management; Thermal management of electronics;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-7803-8357-5
DOI :
10.1109/ITHERM.2004.1318242
