DocumentCode :
3241182
Title :
Ebullition characteristics of an isolated surface microstructure for immersion cooled heat sinks
Author :
Medavaram, Gayathri L. ; Bhavnani, Sushil H. ; Jaeger, Richard C.
Author_Institution :
Dept. of Mech. Eng., Auburn Univ., AL, USA
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
1
Abstract :
An understanding of the fundamentals of the boiling mechanism is essential if phase-change liquid immersion cooling is to emerge as a cooling option for the next generation of data servers and other high performance electronics. The present work is an experimental study on the effect of cavity mouth size on the nucleation characteristics of a single isolated micro-pyramidal reentrant cavity. Cavity mouth size has long been known to be a primary variable determining the ebullition characteristics of microscopic structures present on a pool boiling heat sink surface. Isolated pyramidal shaped cavities with square mouth sizes of 7 μm, 19 μm and 25 μm etched in polished silicon using an anisotropic etch were evaluated in this study. Serpentine thin film heaters (6.9 mm×6.9 mm) deposited on a Borofloat® glass substrate and anodically bonded to the silicon cavity section served as heat sources. All experiments were conducted at atmospheric pressure in dielectric fluids, HFE-7100 and FC-72, popular in thermal management applications. High speed photography (up to 600 frames/sec) was used to record and quantify the effect of heat flux on bubble departure frequency and departure diameters under subcooled and saturated conditions. The bubble departure diameters increased with an increase in the cavity mouth size. Frequency and bubble departure size, both decreased with increased subcooling.
Keywords :
aluminium; boiling; bubbles; crystal microstructure; dielectric liquids; elemental semiconductors; etching; heat sinks; heating; metallic thin films; microcavities; nucleation; silicon; surface structure; undercooling; wafer bonding; 19 micron; 25 micron; 7 micron; Al; Borofloat® glass substrate; FC-72 dielectric fluids; HFE-7100 dielectric fluids; Si; anisotropic etching; anodic bonding; boiling mechanism; bubble; data servers; ebullition properties; electronics; heat flux; heat sources; high speed photography; immersion cooled heat sinks; isolated micropyramidal reentrant cavity; isolated surface microstructure; microscopic structures; nucleation; phase change liquid immersion cooling; polished silicon cavity; pool boiling heat sink surface; serpentine thin film heaters; subcooling; thermal management applications; Dielectric substrates; Dielectric thin films; Etching; Frequency; Heat sinks; Immersion cooling; Microstructure; Mouth; Silicon; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1318245
Filename :
1318245
Link To Document :
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