DocumentCode
3241286
Title
Experimental study of a flat silicon heat pipe with microcapillary grooves
Author
Gillot, C. ; Lai, Andy ; Ivanova, Milena ; Avenas, Y. ; Schaeffer, Carsten ; Fournier, E.
Author_Institution
DRT, CEA, Grenoble, France
Volume
2
fYear
2004
fDate
1-4 June 2004
Firstpage
47
Abstract
An increase in power densities in electronic devices is a direct consequence of their miniaturization and performance improvements. We propose the use of flat miniature heat pipes with micro capillary grooves to spread heat flux across a heat sink. Silicon/water heat pipes were fabricated and tested to demonstrate the feasibility of heat spreading with this type of heat pipe.
Keywords
elemental semiconductors; heat pipes; heat sinks; micromachining; silicon; sputter etching; thermal conductivity; thermal resistance; Si; electronic devices; flat miniature heat pipes; flat silicon heat pipe; heat flux; heat sink; microcapillary grooves; miniaturization; power density; silicon-water heat pipes; Cold plates; Electronic components; Etching; Isothermal processes; Silicon; Temperature; Thermal conductivity; Thermal resistance; Voltage; Water heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN
0-7803-8357-5
Type
conf
DOI
10.1109/ITHERM.2004.1318251
Filename
1318251
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