Modular Interconnect Packaging for Scaleable Systems(MIPSS) for Automatic Test Equipment - IEEE-P1693

This standard defines the electrical and mechanical specifications of a modular interconnect packaging system design for automatic test system (ATS). It specifically describes a building block approach based upon the integration of three elements: (1) the outer enclosure and the inner Eurocard standard mechanical chassis that forms the mechanical structure of the building block with alignment features to mate with other enclosures (building blocks); (2) revised IEEE-1155 Standard for VME extensions for Instrumentation (VXI), that adds serial bus control to the backplane, a new pluggable virtual power source, and extends the VXI module length to directly couple with rear connectors of the IEEE-P1505 receiver fixture interface (RFI) standard; and (3) the segmentation of the IEEE-P1505 RFI receiver framework to match size of the basic building block while also meeting the intent of the IEEE-P1505.1 common test interface (CTI) pin map standard.