DocumentCode :
3241393
Title :
Two-phase thermal management using a small-scale, heat transfer cell based on vibration-induced droplet atomization
Author :
Heffington, S.N. ; Glezer, A.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
90
Abstract :
A two-phase heat transfer module in which thin-film evaporation on the hot surface is achieved using surface droplet atomization is described and characterized. Surface atomization is achieved using a vibration-induced droplet atomization (VIDA) process in which small liquid droplets are produced within a sealed heat transfer cell and are propelled onto the heated surface. The VIDA technique involves the violent break-up of thin liquid layers on the vibrating surface of a piezoelectrically driven membrane that is operated at resonance. Liquid is supplied to the atomizer at a controlled rate using an integrated miniature piezoelectric pump thereby enabling orientation insensitive cell operation. The impact of the atomized droplets on the heated surface forms a thin film that evaporates continuously and the resulting vapor is condensed both on the internal surfaces of the heat transfer cell and on the surface of the atomized droplets. The condensate is collected and returned to the atomizer module by the integral diaphragm pump. The present paper describes the operation and characterization of a small-scale VIDA heat transfer module for cooling integrated circuits at the power level of desktop microprocessors. A unique element of the new cell is the addition of an internal synthetic jet that operates in the vapor space and regulates the droplet motion towards the heated surface and the transport of the vapor. Particular emphasis is placed on the cell´s operating characteristics and cooling capabilities. Heat fluxes as high as 420 W/cm2 have been realized at die temperature below 135°C.
Keywords :
cooling; drops; evaporation; jets; liquid films; membranes; microprocessor chips; modules; piezoelectricity; pumps; thermal management (packaging); thin films; condensate; cooling integrated circuits; desktop microprocessors; droplet motion; heat fluxes; heat transfer cell; heated surface; hot surface; insensitive cell operation; integral diaphragm pump; integrated miniature piezoelectric pump; internal surfaces; internal synthetic jet; liquid droplets; piezoelectrically driven membrane; power level; surface droplet atomization; thin liquid layers; thin-film evaporation; two phase heat transfer module; two phase thermal management; vapor space; vibrating surface; vibration-induced droplet atomization; Atomic layer deposition; Biomembranes; Cooling; Heat transfer; Piezoelectric films; Propulsion; Resonance; Space heating; Thermal management; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1318261
Filename :
1318261
Link To Document :
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