Lead-free 96.5Sn-3.5Ag flip chip solder joint reliability analysis

Author

Pang, John H L ; Yeo, Alvin ; Low, T.H. ; Che, F.X.

Author_Institution

Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore

Volume

2

fYear

2004

fDate

1-4 June 2004

Firstpage

160

Abstract

Lead-free 96.5Sn/3.5Ag flip chip solder joints were subjected to both thermal shock (-55°C to 125°C) and thermal cycling (-40°C to 125°C) reliability tests respectively. Two-parameter Weibull distribution plots, the Mean Time to Failure (MTTF) life are compared. Scanning electron microscopy (SEM) examination was performed on the cross-section surface of failed samples to observe the failure sites and modes. Finite element modeling and simulation of the thermal cycling and thermal shock tests were simulated. An elastic-plastic-creep analysis model was implemented to simulate time independent plasticity and time dependent creep deformations in the solder joints. Solder joint fatigue models were used for life prediction analysis employing the inelastic strain parameters derived from the finite element results.

Keywords

Weibull distribution; chip-on-board packaging; creep; elastic deformation; failure analysis; fatigue testing; finite element analysis; flip-chip devices; integrated circuit design; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; internal stresses; plastic deformation; plasticity; scanning electron microscopy; silver alloys; solders; surface structure; thermal shock; tin alloys; MTTF; SEM; Sn-Ag; Weibull distribution; elastic-plastic-creep analysis model; failure sites; finite element modeling; flip chip solder joint reliability analysis; inelastic strain parameters; mean time to failure; reliability tests; scanning electron microscopy; solder joint fatigue model; surface cross section; thermal cycling tests; thermal shock tests; time dependent creep deformations; time independent plasticity; Deformable models; Electric shock; Environmentally friendly manufacturing techniques; Finite element methods; Flip chip solder joints; Lead; Scanning electron microscopy; Soldering; Testing; Weibull distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on

Print_ISBN

0-7803-8357-5

Type

conf

DOI

10.1109/ITHERM.2004.1318275

Filename

1318275