DocumentCode
3241771
Title
Effective defect management strategies for emerging fab needs
Author
Nurani, Raman K.
Author_Institution
KLA-Tencor Inc., San Jose, CA, USA
fYear
2001
fDate
2001
Firstpage
33
Lastpage
37
Abstract
The evolution of wafer fabrication technology and processes has seen different characteristics and varying nature of yield-limiting killer defects on the wafers. This has forced the innovation of a more sensitive and broader range of defect inspection technologies in the marketplace. Given the changing nature of defect characteristics, the multiple choices of inspection technologies, and the increasing magnitudes of fab investment costs, the problem of determining an effective defect inspection strategy for a fab has become increasingly complex. In this paper, we present the essential steps required to design and implement a cost optimal defect management strategy
Keywords
inspection; integrated circuit economics; integrated circuit yield; strategic planning; cost optimal defect management; defect management strategies; fab investment costs; inspection technologies; wafer fabrication technology; yield-limiting killer defects; Chemical processes; Chemical technology; Copper; Cost function; Fabrication; Frequency; Inspection; Investments; Sampling methods; Technological innovation;
fLanguage
English
Publisher
ieee
Conference_Titel
Statistical Methodology, IEEE International Workshop on, 2001 6yh.
Conference_Location
Kyoto
Print_ISBN
0-7803-6688-3
Type
conf
DOI
10.1109/IWSTM.2001.933821
Filename
933821
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