• DocumentCode
    3241771
  • Title

    Effective defect management strategies for emerging fab needs

  • Author

    Nurani, Raman K.

  • Author_Institution
    KLA-Tencor Inc., San Jose, CA, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    33
  • Lastpage
    37
  • Abstract
    The evolution of wafer fabrication technology and processes has seen different characteristics and varying nature of yield-limiting killer defects on the wafers. This has forced the innovation of a more sensitive and broader range of defect inspection technologies in the marketplace. Given the changing nature of defect characteristics, the multiple choices of inspection technologies, and the increasing magnitudes of fab investment costs, the problem of determining an effective defect inspection strategy for a fab has become increasingly complex. In this paper, we present the essential steps required to design and implement a cost optimal defect management strategy
  • Keywords
    inspection; integrated circuit economics; integrated circuit yield; strategic planning; cost optimal defect management; defect management strategies; fab investment costs; inspection technologies; wafer fabrication technology; yield-limiting killer defects; Chemical processes; Chemical technology; Copper; Cost function; Fabrication; Frequency; Inspection; Investments; Sampling methods; Technological innovation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Statistical Methodology, IEEE International Workshop on, 2001 6yh.
  • Conference_Location
    Kyoto
  • Print_ISBN
    0-7803-6688-3
  • Type

    conf

  • DOI
    10.1109/IWSTM.2001.933821
  • Filename
    933821