DocumentCode :
3241948
Title :
Embedding mobile agent technology into real time vibration sensor for condition-based maintenance
Author :
Basari, Abd Samad Hasan ; Hussin, Burairah ; Shibghatullah, Abdul Samad ; Jiun, Yau Wen
Author_Institution :
Fac. of Inf. & Commun. Technol., Univ. Teknikal Malaysia Melaka, Durian Tunggal, Malaysia
fYear :
2011
fDate :
27-29 May 2011
Firstpage :
594
Lastpage :
598
Abstract :
Machines performance and its availability in the factory are essential to the production unit. Therefore the technical staffs have to monitor the equipment to ensure everything is in good condition. However, the technical staffs including engineers are underutilized. This is due to they have to check the machines at different places by following the schedule. This research aims to assist technical staff including engineers to solve these problems. A system to evaluate the machines´ condition and notify to the engineers is developed. The combination of mobile agent and vibration sensors technology are utilized to implement the system. The role of vibration sensor is to monitor the condition of the machine. Meanwhile the mobile agent technology is used to create the wireless environment for machine and user to communicate each other. When the vibration conditions exceed the normal value, a message via SMS (Short Message System) will be sent to engineer´s hand phone and email to notify the problem.
Keywords :
condition monitoring; electronic mail; electronic messaging; maintenance engineering; mechanical engineering computing; mobile agents; mobile radio; production facilities; sensors; vibrations; SMS; condition based maintenance; e-mail; factory; hand phone; machine performance; mobile agent technology; production unit; short message system; vibration sensor technology; Accelerometers; MATLAB; Monitoring; Robots; Security; Vibration measurement; Vibrations; condition monitoring; mobile agent technology; vibration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Communication Software and Networks (ICCSN), 2011 IEEE 3rd International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-61284-485-5
Type :
conf
DOI :
10.1109/ICCSN.2011.6014795
Filename :
6014795
Link To Document :
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