• DocumentCode
    3242060
  • Title

    Ultra high-power 2.5 kV-1800 A power pack IGBT

  • Author

    Takahashi, Yoshikazu ; Yoshikawa, Koh ; Koga, Takeharu ; Soutome, Masayuki ; Takano, Tetsumi ; Kirihata, Humiaki ; Seki, Yasukazu

  • Author_Institution
    Fuji Electr. Corp. Res. & Dev. Ltd., Matsumoto, Japan
  • fYear
    1997
  • fDate
    26-29 May 1997
  • Firstpage
    233
  • Lastpage
    236
  • Abstract
    The Power Pack IGBT has been tested in detail under several practical inverter systems and has obtained much useful data. Using this data and advanced technology, we have improved some items and finally developed an ultra high-power 2.5 kV-1800 A Power Pack IGBT (flat-packaged Reverse Conducting IGBT). One of the important improvements is the contact technology for the IGBT chip, and another is the electric discharge capability of the IGBT and diode chips. In addition to these important improvements, using our original 27.5×27.5mm2 large IGBT and diode chips, and square flat package structure, we have achieved a compact and powerful device. The saturation voltage is 4.5 V at the collector current of 1800A and Tj=125°C. The on-state voltage of the diode part is 3.5 V at the anode current of 1800 A and Tj=125°C. The turn-off capability is over 4000A at the peak collector voltage of 2400 V. In this paper, the device structure, the chip technology, the parallel connection technology inside the package, the high blocking voltage capability, and other important experimental results are described
  • Keywords
    insulated gate bipolar transistors; invertors; power transistors; semiconductor device packaging; 125 degC; 1800 A; 2.5 kV; 3.5 V; 4.5 V; blocking voltage capability; collector current; contact technology; electric discharge capability; flat-packaged reverse conducting device; inverter systems; on-state voltage; parallel connection technology; peak collector voltage; power pack IGBT; saturation voltage; square flat package structure; turn-off capability; Ceramics; Diodes; Electrodes; Insulated gate bipolar transistors; Inverters; Packaging; Pressure control; Production facilities; Research and development; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and IC's, 1997. ISPSD '97., 1997 IEEE International Symposium on
  • Conference_Location
    Weimar
  • ISSN
    1063-6854
  • Print_ISBN
    0-7803-3993-2
  • Type

    conf

  • DOI
    10.1109/ISPSD.1997.601480
  • Filename
    601480