DocumentCode :
3242369
Title :
Thermal, mechanical and optical modelling of VCSEL packaging
Author :
Gwyer, D. ; Misselbrook, P. ; Philpot, D. ; Bailey, C. ; Conway, P.P. ; Williams, K.
Author_Institution :
Centre for Numerical Modelling & Process Anal., Greenwich Univ., London, UK
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
405
Abstract :
Hybrid OECB (Opto-Electrical Circuit Boards) are expected to make a significant impact in the telecomm switches arena within the next five years, creating optical backplanes with high speed point-to-point optical interconnects. OECB´s incorporate short range optical interconnects, and are based on VCSEL (Vertical Cavity Surface Emitting Diode) and PD (Photo Diode) pairs, connected to each other via embedded waveguides in the OECB. The VCSEL device is flip-chip assembled onto an organic substrate with embedded optical waveguides. The performance of the VCSEL device is governed by the thermal, mechanical and optical characteristics of this assembly. During operation, the VCSEL device will heat up and the thermal change together with the CTE mismatch in the materials, will result in potential misalignment between the VCSEL apertures and the waveguide openings in the substrate. Any degree of misalignment will affect the optical performance of the package. This paper will present results from a highly coupled modelling analysis involving thermal, mechanical and optical models. The paper will also present results from an optimisation analysis based on Design of Experiments (DOE).
Keywords :
chip-on-board packaging; flip-chip devices; integrated optoelectronics; optical backplanes; optical waveguides; photodiodes; surface emitting lasers; thermal expansion; VCSEL apertures; VCSEL device; VCSEL packaging; coupled modelling analysis; embedded optical waveguides; flip-chip assembled-organic substrate; hybrid optoelectrical circuit boards; optical backplanes; optical model; optimisation analysis; photodiode; point-point optical interconnects; potential misalignment; telecomm switches arena; thermal expansion; thermomechanical model; vertical cavity surface emitting diode packaging; waveguide openings; Assembly; Diodes; High speed optical techniques; Optical devices; Optical interconnections; Optical waveguides; Packaging; Printed circuits; Stimulated emission; Vertical cavity surface emitting lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1318311
Filename :
1318311
Link To Document :
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