• DocumentCode
    3242671
  • Title

    Improvement of surface roughness and conductivity by calendering process for printed electronics

  • Author

    Nguyen, Ho-anh-duc ; Hoang, Nguyen ; Shin, Kee-Hyun ; Lee, Sangyoon

  • Author_Institution
    Dept. of Mech. Design & Production Eng., Konkuk Univ., Seoul, South Korea
  • fYear
    2011
  • fDate
    23-26 Nov. 2011
  • Firstpage
    685
  • Lastpage
    687
  • Abstract
    A mass production technique of roll-to-roll (R2R) gravure printing system with high resolution and pattern fidelity has been tested for manufacturing electronic products. Performance of printed electronics depends greatly upon the surface geometry of printed pattern such as thickness and roughness. We applied a calendering process to control the surface geometry and the resistivity of printed pattern. We also investigated the effect of process parameters including temperature, pressure, and speed. Experimental results demonstrate that the calendering process should be useful for R2R printed electronics.
  • Keywords
    RLC circuits; electronic equipment manufacture; mass production; printing; surface conductivity; surface roughness; R2R printed electronics; RLC circuit pattern; calendering process; electronic product manufacturing; mass production technique; pattern fidelity; printed electronics; printed pattern; printed pattern resistivity; roll-to-roll gravure printing system; surface conductivity; surface geometry; surface roughness; Conductivity; Microstructure; Response surface methodology; Rough surfaces; Substrates; Surface roughness; Surface treatment; Calendering process; printed electronics; roll-to-roll process;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ubiquitous Robots and Ambient Intelligence (URAI), 2011 8th International Conference on
  • Conference_Location
    Incheon
  • Print_ISBN
    978-1-4577-0722-3
  • Type

    conf

  • DOI
    10.1109/URAI.2011.6145908
  • Filename
    6145908