DocumentCode
3242671
Title
Improvement of surface roughness and conductivity by calendering process for printed electronics
Author
Nguyen, Ho-anh-duc ; Hoang, Nguyen ; Shin, Kee-Hyun ; Lee, Sangyoon
Author_Institution
Dept. of Mech. Design & Production Eng., Konkuk Univ., Seoul, South Korea
fYear
2011
fDate
23-26 Nov. 2011
Firstpage
685
Lastpage
687
Abstract
A mass production technique of roll-to-roll (R2R) gravure printing system with high resolution and pattern fidelity has been tested for manufacturing electronic products. Performance of printed electronics depends greatly upon the surface geometry of printed pattern such as thickness and roughness. We applied a calendering process to control the surface geometry and the resistivity of printed pattern. We also investigated the effect of process parameters including temperature, pressure, and speed. Experimental results demonstrate that the calendering process should be useful for R2R printed electronics.
Keywords
RLC circuits; electronic equipment manufacture; mass production; printing; surface conductivity; surface roughness; R2R printed electronics; RLC circuit pattern; calendering process; electronic product manufacturing; mass production technique; pattern fidelity; printed electronics; printed pattern; printed pattern resistivity; roll-to-roll gravure printing system; surface conductivity; surface geometry; surface roughness; Conductivity; Microstructure; Response surface methodology; Rough surfaces; Substrates; Surface roughness; Surface treatment; Calendering process; printed electronics; roll-to-roll process;
fLanguage
English
Publisher
ieee
Conference_Titel
Ubiquitous Robots and Ambient Intelligence (URAI), 2011 8th International Conference on
Conference_Location
Incheon
Print_ISBN
978-1-4577-0722-3
Type
conf
DOI
10.1109/URAI.2011.6145908
Filename
6145908
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