• DocumentCode
    3242829
  • Title

    Thermal insulation using fullerenes

  • Author

    Wexler, Eugene M. ; Loutfy, Raouf O.

  • Author_Institution
    MER Corp., Tucson, AZ, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    570
  • Abstract
    A novel type of multi-layer vacuum insulation based on carbon nano-materials, namely fullerenes, has been demonstrated. The design is based on unique thermal insulation properties of fullerenes, arising from their electronic structure, as well as proprietary deposition technique using thin layers of reflective material as a support. As a result of experimental testing, the fabricated samples of fullerene-based insulation were shown to possess R-values of 36 to 40 per inch of thickness at cryogenic temperatures, which considerably exceeds those of commonly available insulation materials (for example, polyurethane (R6.7), expanded polystyrene (R3.8), and even vacuum insulated panels (R9∼24)). Application of such insulation will result in significant size and weight reduction while maintaining cost-effectiveness.
  • Keywords
    carbon nanotubes; defect states; fullerenes; liquid phase deposition; multilayers; nanostructured materials; nanotechnology; semiconductor materials; spray coating techniques; thermal conductivity; thermal insulating materials; thermal insulation; thermal management (packaging); vacuum insulation; C; carbon nanomaterials; cost effectiveness; cryogenic temperatures; electronic structure; expanded polystyrene; fullerenes; multilayer vacuum insulation; polyurethane; reflective material; size reduction; thermal insulation; thin layer deposition; weight reduction; Chemical technology; Consumer electronics; Costs; Electric resistance; Insulation; Protection; Surface resistance; Temperature distribution; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
  • Print_ISBN
    0-7803-8357-5
  • Type

    conf

  • DOI
    10.1109/ITHERM.2004.1318335
  • Filename
    1318335