Title :
High-speed serial I/O trends, standards and techniques
Author :
Zarkeshvari, F. ; Noel, P. ; Kwasrkwski, T.
Author_Institution :
Department of Electronics, Carleton University
Abstract :
The gad of this paper is to provide the reader with an overview of the major interconnect standards utilizing the high-speed serial I/O circuitry and to outline several design techniques required to successfully implement a typical multi- GHz serial I/O device. Several major design obstacles are presented followed by a discussion of potential design techniques that may be used to overcome such implementation issues. The paper will cover three main design approaches: low swing differential signaling, compensation based signaling and multiIevel signaling.
Keywords :
Bandwidth; Costs; Fabrics; Frequency; Integrated circuit interconnections; Packaging; Packet switching; Pins; Signal design; Standards development;
Conference_Titel :
Electrical and Electronics Engineering, 2004. (ICEEE). 1st International Conference on
Conference_Location :
Acapulco, Mexico
Print_ISBN :
0-7803-8531-4
DOI :
10.1109/ICEEE.2004.1433889